Patent Assignment
Reel/Frame 028609/0810
Assignment of Assignor's Interest
Recorded: 2012-07-23
Pages: 10
Assignors
VON KOBLINSKI, CARSTEN
Executed: 2012-07-20
KNABL, MICHAEL
Executed: 2012-07-20
MEYER, URSULA
Executed: 2012-07-23
SANTOS RODRIGUEZ, FRANCISCO JAVIER
Executed: 2012-07-20
BREYMESSER, ALEXANDER
Executed: 2012-07-20
BROCKMEIER, ANDRE
Executed: 2012-07-20
Assignee
INFINEON TECHNOLOGIES AG
AM CAMPEON 1 - 12, NEUBIBERG, 85579, GERMANY
Covered Property
(1)
Chip Package and a Method for Manufacturing a Chip Package