Patent Assignment
Reel/Frame 028630/0469
Assignment of Assignor's Interest
Recorded: 2012-07-25
Pages: 2
Assignors
YU, CHIH-KUANG
Executed: 2011-03-14
CHERN, CHYI SHYUAN
Executed: 2011-03-14
HSIA, HSING-KUO
Executed: 2011-03-14
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN ROAD 6, SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, 300-77, TAIWAN
Covered Property
(1)
Methods of Fabricating Light Emitting Diode Packages
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jul 25, 2012
From: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
To: TSMC SOLID STATE LIGHTING LTD.
Reel/Frame 028630/0494 →
Change of Name
Nov 30, 2015
From: TSMC SOLID STATE LIGHTING LTD.
To: CHIP STAR LTD.
Reel/Frame 037172/0212 →
Merger
Nov 30, 2015
From: CHIP STAR LTD.
To: EPISTAR CORPORATION
Reel/Frame 037437/0049 →
Change of Name
Apr 22, 2026
From: EPISTAR CORPORATION
To: ENNOSTAR CORPORATION
Reel/Frame 075513/0783 →