IP Library › Assignment 037172/0212
Patent Assignment
Reel/Frame 037172/0212

Change of Name

Recorded: 2015-11-30 Pages: 14
Assignor
TSMC SOLID STATE LIGHTING LTD.
Executed: 2015-04-02
Assignee
CHIP STAR LTD.
NO. 9 LIXING 4TH RD., HSINCHU SCIENCE AND INDUSTRIAL PARK, HSINCHU CITY, TAIWAN
Covered Properties (10)
Dicing-Free Led Fabrication
Patent: 8,912,033 →
Application: 12/900,663 →
Publication: US 2012/0088322
Led Module and Method of Bonding Thereof
Patent: 8,632,221 →
Application: 13/286,562 →
Publication: US 2013/0107549
Methods of Fabricating Light Emitting Diode Packages
Patent: 8,598,617 →
Application: 13/557,272 →
Publication: US 2012/0286240
Led Module and Method of Bonding Thereof
Patent: 8,894,249 →
Application: 14/153,347 →
Publication: US 2014/0112009
Light-Emitting Diode with Current-Spreading Region
Application: 14/472,495 →
Publication: US 2015/0053918
Led Module and Method of Bonding Thereof
Patent: 9,857,063 →
Application: 14/549,596 →
Publication: US 2015/0078014
Vertical Led Chip Package on Tsv Carrier
Patent: 9,362,474 →
Application: 14/556,273 →
Publication: US 2015/0083996
Thermal Protection Structure for Multi-Junction Led Module
Patent: 9,504,120 →
Application: 14/556,318 →
Publication: US 2015/0123571
Light-Emitting Diode Lamp and Method of Making
Application: 14/558,788 →
Publication: US 2015/0085493
Dicing-Free Led Fabrication
Patent: 9,472,714 →
Application: 14/566,782 →
Publication: US 2015/0093844
Related Assignments (17)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 25, 2012
From: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
To: TSMC SOLID STATE LIGHTING LTD.
Reel/Frame 028630/0494 →
Assignment of Assignor's Interest Jul 25, 2012
From: YU, CHIH-KUANG; CHERN, CHYI SHYUAN; HSIA, HSING-KUO
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 028630/0469 →
Assignment of Assignor's Interest Jan 13, 2014
From: YEH, WEI-YU
To: TSMC SOLID STATE LIGHTING LTD.
Reel/Frame 031950/0415 →
Assignment of Assignor's Interest Aug 29, 2014
From: CHEN, DING-YUAN; YU, CHEN-HUA; CHIOU, WEN-CHIH
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 033636/0813 →
Assignment of Assignor's Interest Aug 29, 2014
From: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
To: TSMC SOLID STATE LIGHTING LTD.
Reel/Frame 033636/0911 →
Assignment of Assignor's Interest Nov 21, 2014
From: YEH, WEI-YU
To: TSMC SOLID STATE LIGHTING LTD.
Reel/Frame 034225/0879 →
Assignment of Assignor's Interest Dec 1, 2014
From: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
To: TSMC SOLID STATE LIGHTING LTD.
Reel/Frame 034284/0014 →
Assignment of Assignor's Interest Dec 1, 2014
From: YEH, WEI-YU
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 034284/0009 →
Assignment of Assignor's Interest Dec 11, 2014
From: HSIA, HSING-KUO; YU, CHIH-KUANG; KUO, GORDON
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 034476/0242 →
Assignment of Assignor's Interest Dec 11, 2014
From: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
To: TSMC SOLID STATE LIGHTING LTD.
Reel/Frame 034476/0255 →
Assignment of Assignor's Interest Apr 10, 2015
From: SUN, CHIH-HSUAN; LEE, HSIAO-WEN
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 035375/0465 →
Assignment of Assignor's Interest Apr 10, 2015
From: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
To: TSMC SOLID STATE LIGHTING LTD.
Reel/Frame 035375/0550 →
Assignment of Assignor's Interest Apr 15, 2015
From: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
To: TSMC SOLID STATE LIGHTING LTD.
Reel/Frame 035410/0750 →
Assignment of Assignor's Interest Apr 15, 2015
From: WANG, CHUNG YU
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 035410/0687 →
Merger Nov 30, 2015
From: CHIP STAR LTD.
To: EPISTAR CORPORATION
Reel/Frame 037437/0049 →
Assignment of Assignor's Interest Dec 17, 2025
From: EPISTAR CORPORATION
To: TAU CETI VENTURES LLC
Reel/Frame 073969/0972 →
Change of Name Apr 22, 2026
From: EPISTAR CORPORATION
To: ENNOSTAR CORPORATION
Reel/Frame 075513/0783 →