IP Library Patent Application 14558788
Patent Application
App. No. 14/558,788

LIGHT-EMITTING DIODE LAMP AND METHOD OF MAKING

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Quick Facts
Patent No.
US None
App. No.
14/558,788
Abstract

An apparatus includes a light-emitting device. A diffuser is disposed over the light-emitting device. A heat sink is disposed below, and thermally coupled to, the light-emitting device. The heat sink includes a body and a plurality of fins that radially protrude from the body of the heat sink. The fins define a plurality of ducts. A cover plate circumferentially surrounds the heat sink. The cover plate includes a plurality of openings that are disposed over the plurality of ducts, respectively.

Claims (39)

1 . An apparatus, comprising:

a light-emitting device;

a diffuser disposed over the light-emitting device;

a heat sink disposed below, and thermally coupled to, the light-emitting device, wherein the heat sink includes a body and a plurality of fins that radially protrude from the body of the heat sink, and wherein the fins define a plurality of ducts; and

a cover plate that circumferentially surrounds the heat sink, wherein the cover plate includes a plurality of openings that are disposed over the plurality of ducts, respectively.

2 . The apparatus of claim 1 , wherein:

the openings includes a subset of first openings and a plurality of second openings;

the first openings are aligned with the second openings, respectively, along the ducts;

the first openings are each disposed near a first end of each of the ducts; and

the second openings are each disposed near a second end of each of the ducts opposite the first end.

3 . The apparatus of claim 1 , wherein the fins each have a curved cross-sectional profile.

4 . The apparatus of claim 1 , wherein the fins each include a hole therein.

5 . The apparatus of claim 1 , wherein the body of the heat sink and the fins constitute a single seamless structure.

6 . The apparatus of claim 1 , wherein the cover plate is thermally insulating.

7 . The apparatus of claim 1 , wherein the body of the heat sink includes one or more openings therein.

8 . The apparatus of claim 1 , wherein the light-emitting device, the diffuser, the heat sink, and the cover plate are parts of a light bulb.

9 . The apparatus of claim 1 , wherein the body of the heat sink includes a cavity therein.

10 . The apparatus of claim 9 , further comprising a power supply disposed inside the cavity of the body of the heat sink, wherein the power supply is configured to supply electrical power to the light-emitting device.

11 . The apparatus of claim 1 , wherein the light-emitting device includes a light-emitting diode (LED).

12 . A lighting structure, comprising:

a light-emitting diode (LED);

a diffuser disposed over the LED and providing a partial enclosure for the LED;

a heat sink thermal conductively coupled to the LED, wherein the heat sink includes a body and a plurality of outwardly-protruding fins that define a plurality of airflow channels; and

a thermally insulating cover plate that circumferentially surrounds the heat sink, wherein the thermally insulating cover plate includes a plurality of top openings and a plurality of bottom openings aligned with the top openings, respectively, wherein each pair of top and bottom openings are in fluid communication with a respective one of the airflow channels.

13 . The lighting structure of claim 12 , wherein an outline of the fins conform to an outline of a light bulb.

14 . The lighting structure of claim 12 , wherein:

the fins each include an opening therein; and

the body of the heat sink includes one or more openings therein.

15 . The lighting structure of claim 12 , wherein the body of the heat sink and the fins constitute a single seamless structure.

16 . The lighting structure of claim 12 , wherein the body of the heat sink includes a cavity therein, the cavity defining a power supply enclosure configured to house therein a power supply for the LED.

17 . The lighting structure of claim 12 , wherein the LED, the diffuser, the heat sink, and the thermally insulating cover plate are components of a lamp.

18 . A lamp, comprising:

a light-emitting diode (LED);

a diffuser disposed over the LED and forming a partial enclosure for the LED;

a heat sink thermal conductively coupled to the LED, wherein the heat sink includes a body that contains a cavity therein and a plurality of elongate fins protruding from the body, wherein each pair of adjacent fins defines a different airflow duct, and wherein the fins each have a cross-sectional profile that resembles a cross-sectional profile of a light bulb;

a thermally insulating structure that circumferentially covers the heat sink, wherein the thermally insulating structure includes a plurality of first openings and a plurality of second openings, wherein each first opening is aligned with a respective one of the second openings in a direction parallel to a direction in which the airflow ducts extend, and wherein each pair of aligned first and second openings is aligned with a respective one of the airflow ducts; and

a power supply disposed inside the cavity of the body of the heat sink, wherein the power supply supplies electrical power for the LED.

19 . The lamp of claim 18 , wherein the fins each include an opening therein.

20 . The lighting structure of claim 18 , wherein the body of the heat sink and the fins constitute a single seamless structure.

Assignments (4)
CHANGE OF NAME Recorded Nov 30, 2015
From: TSMC SOLID STATE LIGHTING LTD.
To: CHIP STAR LTD.
Reel/Frame 037172/0212 →
MERGER Recorded Nov 30, 2015
From: CHIP STAR LTD.
To: EPISTAR CORPORATION
Reel/Frame 037437/0049 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 10, 2015
From: SUN, CHIH-HSUAN; LEE, HSIAO-WEN
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 035375/0465 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 10, 2015
From: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
To: TSMC SOLID STATE LIGHTING LTD.
Reel/Frame 035375/0550 →