Patent Assignment
Reel/Frame 035410/0750
Assignment of Assignor's Interest
Recorded: 2015-04-15
Pages: 3
Assignor
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Executed: 2012-03-01
Assignee
TSMC SOLID STATE LIGHTING LTD.
9, LI-HSIN 4TH RD., HSINCHU SCIENCE PARK, HSINCHU, 300-77, TAIWAN
Covered Property
(1)
Vertical Led Chip Package on Tsv Carrier
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Apr 15, 2015
From: WANG, CHUNG YU
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 035410/0687 →
Change of Name
Nov 30, 2015
From: TSMC SOLID STATE LIGHTING LTD.
To: CHIP STAR LTD.
Reel/Frame 037172/0212 →
Merger
Nov 30, 2015
From: CHIP STAR LTD.
To: EPISTAR CORPORATION
Reel/Frame 037437/0049 →
Change of Name
Apr 22, 2026
From: EPISTAR CORPORATION
To: ENNOSTAR CORPORATION
Reel/Frame 075513/0783 →