Patent Assignment
Reel/Frame 028632/0470
Assignment of Assignor's Interest
Recorded: 2012-07-25
Pages: 3
Assignors
IWANO, TOMOHIRO
Executed: 2012-05-30
AKIMOTO, HIROTAKA
Executed: 2012-06-27
NARITA, TAKENORI
Executed: 2012-05-30
KIMURA, TADAHIRO
Executed: 2012-06-04
RYUZAKI, DAISUKE
Executed: 2012-06-12
Assignee
HITACHI CHEMICAL COMPANY, LTD.
1-1, NISHI-SHINJUKU 2-CHOME,, SHINJUKU-KU, TOKYO, 163-0449, JAPAN
Covered Property
(1)
Slurry, Polishing Fluid Set, Polishing Fluid, and Substrate Polishing Method Using Same
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Address
Sep 28, 2017
From: HITACHI CHEMICAL COMPANY, LTD.
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 044045/0454 →
Change of Name
Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name
Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →