Patent Assignment
Reel/Frame 028638/0713
Assignment of Assignor's Interest
Recorded: 2012-07-25
Pages: 4
Assignors
CHIU, TZU-WEI
Executed: 2012-07-19
WANG, TZU-YU
Executed: 2012-07-19
HOU, SHANG-YUN
Executed: 2012-07-19
JENG, SHIN-PUU
Executed: 2012-07-19
CHEN, HSIEN-WEI
Executed: 2012-07-19
TENG, HUNG-AN
Executed: 2012-07-19
WU, WEI-CHENG
Executed: 2012-07-19
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Bump Structure for Yield Improvement