Patent Assignment
Reel/Frame 028672/0231
Assignment of Assignor's Interest
Recorded: 2012-07-30
Pages: 2
Assignors
HUNG, KIN YIK
Executed: 2012-07-27
LEUNG, PAK KIN
Executed: 2012-07-26
TANG, CHEUK WAH
Executed: 2012-07-26
HUNG, CHI PING
Executed: 2012-07-26
WIDDOWSON, GARY PETER
Executed: 2012-07-27
Assignee
ASM TECHNOLOGY SINGAPORE PTE LTD
2 YISHUN AVENUE 7, SINGAPORE, 768924, SINGAPORE
Covered Property
(1)
Bond Head for Thermal Compression Die Bonding
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.