Patent Assignment
Reel/Frame 028689/0661
Assignment of Assignor's Interest
Recorded: 2012-07-31
Pages: 2
Assignors
CHOU, MENG-WEI
Executed: 2012-07-09
KUO, HUNG-JUI
Executed: 2012-07-09
HO, MING-CHE
Executed: 2012-07-09
LIU, CHUNG-SHI
Executed: 2012-07-09
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77 R.O.C., TAIWAN
Covered Property
(1)
Method of Forming Post Passivation Interconnects