Patent Assignment
Reel/Frame 028700/0289
Assignment of Assignor's Interest
Recorded: 2012-08-01
Pages: 9
Assignors
NAM, TAE-DUK
Executed: 2012-07-24
KIM, JIN-HO
Executed: 2012-07-24
KIM, HYUK-SU
Executed: 2012-07-24
KIM, HYOUNG-SUK
Executed: 2012-07-24
LEE, TAE-YOUNG
Executed: 2012-07-24
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package Having Supporting Plate and Method of Forming the Same