Patent Assignment
Reel/Frame 028701/0481
Assignment of Assignor's Interest
Recorded: 2012-08-01
Pages: 3
Assignors
HWANG, IN CHUL
Executed: 2012-07-23
KIM, JAE MYUN
Executed: 2012-07-23
KIM, SEUNG JEE
Executed: 2012-07-23
LEE, JIN SU
Executed: 2012-07-23
Assignee
SK HYNIX INC.
2091, GYEONGCHUNG-DAERO, BUBAL-EUB, ICHEON-SI GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Chips Having a Dual-Layered Structure, Packages Having the Same, and Methods of Fabricating the Semiconductor Chips and the Packages