Patent Assignment
Reel/Frame 028708/0634
Assignment of Assignor's Interest
Recorded: 2012-08-02
Pages: 10
Assignors
GEITNER, OTTMAR
Executed: 2012-08-02
HARTNER, WALTER
Executed: 2012-08-02
WOJNOWSKI, MACIEJ
Executed: 2012-08-02
WACHTER, ULRICH
Executed: 2012-08-02
BAUER, MICHAEL
Executed: 2012-08-02
STUECKJUERGEN, ANDREAS
Executed: 2012-08-02
Assignee
INFINEON TECHNOLOGIES AG
AM CAMPEON 1-12, NEUBIBERG, 85579, GERMANY
Covered Property
(1)
Chip Package and a Method for Manufacturing a Chip Package