Patent Assignment
Reel/Frame 028719/0916
Assignment of Assignor's Interest
Recorded: 2012-08-03
Pages: 2
Assignors
CHIU, CHIH-HSIEN
Executed: 2011-08-30
TSAI, TSUNG-HSIEN
Executed: 2011-08-30
YANG, CHAO-YA
Executed: 2011-08-30
Assignee
SILICONWARE PRECISION INDUSTRIES CO., LTD.
NO. 123, SEC. 3, DA FONG ROAD, TANTZU, TAICHUNG, TAIWAN
Covered Property
(1)
Packaging Structure and Method of Fabricating the Same