Patent Assignment
Reel/Frame 028724/0927
Assignment of Assignor's Interest
Recorded: 2012-08-04
Pages: 3
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU,, SUWON-SI, KOREA, REPUBLIC OF
Covered Property
(1)
Multi-Chip Package with a Supporting Member and Method of Manufacturing the Same