Patent Assignment
Reel/Frame 028757/0301
Assignment of Assignor's Interest
Recorded: 2012-08-09
Pages: 9
Assignors
CHIANG, CHIH-WEI
Executed: 2012-08-08
WU, KUANG-CHENG
Executed: 2012-08-08
LEE, WEN-LONG
Executed: 2012-08-08
LEU, PO-HSIUNG
Executed: 2012-08-08
LIU, DING-I
Executed: 2012-08-08
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSIN-CHU SCIENCE PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Profile Pre-Shaping for Replacement Poly Gate Interlayer Dielectric