Patent Assignment
Reel/Frame 028767/0789
Assignment of Assignor's Interest
Recorded: 2012-08-10
Pages: 2
Assignors
MAEDA, SHINNOSUKE
Executed: 2012-08-01
HIRANO, SATOSHI
Executed: 2012-08-01
SAIKI, HAJIME
Executed: 2012-07-30
Assignee
NGK SPARK PLUG CO., LTD.
14-18, TAKATSUJI-CHO, MIZUHO-KU, NAGOYA-SHI, AICHI, 467-8525, JAPAN
Covered Property
(1)
Method of Manufacturing Multilayer Wiring Substrate, and Multilayer Wiring Substrate