Patent Assignment
Reel/Frame 028769/0906
Assignment of Assignor's Interest
Recorded: 2012-08-10
Pages: 3
Assignors
ODA, KAZUNORI
Executed: 2012-07-05
SAKAMOTO, AKIRA
Executed: 2012-07-05
MURATA, YOSHINORI
Executed: 2012-07-10
KAWAI, KENZABURO
Executed: 2012-07-10
SUZUKI, KOICHI
Executed: 2012-07-09
OISHI, MEGUMI
Executed: 2012-07-09
Assignee
DAI NIPPON PRINTING CO., LTD.
1-1, ICHIGAYA-KAGA-CHO 1-CHOME, SHINJUKU-KU, TOKYO-TO, JAPAN
Covered Property
(1)
Led Leadframe or Led Substrate, Semiconductor Device, and Method for Manufacturing Led Leadframe or Led Substrate