Patent Assignment
Reel/Frame 028791/0694
Assignment of Assignor's Interest
Recorded: 2012-08-15
Pages: 3
Assignors
LEE, GYU JEI
Executed: 2012-07-09
LEE, KANG WON
Executed: 2012-07-09
KIM, HYUN JOO
Executed: 2012-07-09
Assignee
SK HYNIX INC.
2091, GYEONGCHUNG-DAERO, BUBAL-EUB, ICHEON-SI GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Chip and Stacked Semiconductor Package Having the Same