Patent Assignment
Reel/Frame 028793/0388
Assignment of Assignor's Interest
Recorded: 2012-08-15
Pages: 2
Assignors
CHENG, JUNG WEI
Executed: 2012-07-20
WANG, TSUNG-DING
Executed: 2012-07-20
LEE, CHIEN-HSUN
Executed: 2012-07-20
CHUANG, CHUN-CHIH
Executed: 2012-07-20
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Package on Package Structures and Methods for Forming the Same