Patent Assignment
Reel/Frame 028796/0839
Assignment of Assignor's Interest
Recorded: 2012-08-16
Pages: 2
Assignor
SAKA, NAOKI
Executed: 2012-07-20
Assignee
SONY CORPORATION
1-7-1 KONAN, MINATO-KU, TOKYO, JAPAN
Covered Property
(1)
Semiconductor Device, Manufacturing Method Thereof, Solid-State Imaging Device, Manufacturing Method Thereof, and Electronic Unit