Patent Assignment
Reel/Frame 028806/0934
Assignment of Assignor's Interest
Recorded: 2012-08-17
Pages: 3
Assignors
HSIEH, CHENG-CHIEH
Executed: 2012-07-06
CHENG, WAY-LEE
Executed: 2012-08-07
HOU, SHANG-YUN
Executed: 2012-07-06
JENG, SHIN-PUU
Executed: 2012-07-09
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77 R.O.C., TAIWAN
Covered Property
(1)
Thermal Structure for Integrated Circuit Package