Patent Assignment
Reel/Frame 028823/0423
Assignment of Assignor's Interest
Recorded: 2012-08-21
Pages: 3
Assignor
BONART, DIETRICH
Executed: 2012-08-21
Assignee
INFINEON TECHNOLOGIES AG
AM CAMPEON 1-12, NEUBIBERG, 85579, GERMANY
Covered Property
(1)
Semiconductor Device Package and Methods of Packaging Thereof