Patent Assignment
Reel/Frame 028847/0171
Assignment of Assignor's Interest
Recorded: 2012-08-24
Pages: 4
Assignors
LU, WEN-HSIUNG
Executed: 2012-08-22
CHENG, MING-DA
Executed: 2012-08-22
WU, YI-WEN
Executed: 2012-08-22
TSAI, YU-PENG
Executed: 2012-08-22
TU, CHIA-WEI
Executed: 2012-08-22
LIU, CHUNG-SHI
Executed: 2012-08-22
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Semiconductor Package Having Protective Layer with Curved Surface and Method of Manufacturing Same