Semiconductor package having protective layer with curved surface and method of manufacturing same

1. A semiconductor package, comprising:

a semiconductor substrate;

a contact pad overlying the semiconductor substrate;

an interconnect layer overlying the contact pad and lining an opening in a first polymer layer disposed over a periphery of the contact pad;

a passivation layer formed between the contact pad and the first polymer layer;

a solder bump overlying the interconnect layer, wherein a region of the solder bump extends into the opening in the first polymer layer; and

a protection layer having a top surface and overlying the interconnect layer and the passivation layer and covering a lower portion of the solder bump;

wherein the protection layer comprises a curved surface region, wherein the curved surface region has a concave surface extending outwards from the solder bump.

2. The semiconductor package of claim 1 , further comprising a second polymer layer between the protection layer and the first polymer layer.

3. The semiconductor package of claim 1 , further comprising a metallization layer between the solder bump and the interconnect layer.

4. The semiconductor package of claim 1 , further comprising a dielectric layer between the semiconductor substrate and the contact pad.

5. The semiconductor package of claim 1 , wherein the solder bump is positioned directly over the contact pad.

6. The semiconductor package of claim 1 , wherein the top surface of the protection layer comprises a lowest point and a highest point, and a distance between the lowest point and the highest point is between about 5 μm and about 40 μm.

7. A semiconductor package, comprising:

a semiconductor substrate;

a contact pad overlying the semiconductor substrate;

an interconnect layer overlying the contact pad and lining an opening in a first polymer layer disposed over the contact pad;

a passivation layer formed between the contact pad and the first polymer layer;

a solder bump overlying the interconnect layer, wherein a region of the solder bump extends into the opening in the first polymer layer; and

a molding compound layer having a top surface and overlying the interconnect layer and the passivation layer and covering a lower portion of the solder bump;

wherein the top surface of the molding compound layer comprises a concave surface region and a planar surface region, the concave surface region being positioned between the solder bump and the planar surface region, wherein the concave surface region extends outwards from the solder bump.

8. The semiconductor package of claim 7 , further comprising a second polymer layer between the molding compound layer and the first polymer layer.

9. The semiconductor package of claim 7 , further comprising a metallization layer between the solder bump and the interconnect layer.

10. The semiconductor package of claim 7 , further comprising a dielectric layer between the semiconductor substrate and the contact pad.

11. The semiconductor package of claim 7 , wherein the solder bump is positioned directly over the contact pad.

12. The semiconductor package of claim 7 , wherein the top surface of the molding compound layer comprises a lowest point and a highest point, and an angle between a horizontal line and an inclined line formed between the lowest point and the highest point is between about 10 degrees and about 50 degrees.

13. A method of forming a device comprising;

forming a contact pad over a semiconductor substrate;

forming a first polymer layer over a periphery of the contact pad, the first polymer layer having an opening exposing a central region of the contact pad;

forming an interconnect over the central region of the contact pad, the interconnect lining the opening of the first polymer layer;

forming a passivation layer between the contact pad and the first polymer layer;

forming a solder bump over the interconnect and electrically connected to the interconnect, wherein a region of the solder bump extends into the opening of the first polymer layer;

covering the solder bump and the passivation layer with a liquid molding compound, the liquid molding compound having a top surface above the solder bump;

pressing down on the top surface of the liquid molding compound while curing same so that a cured molding compound is formed, the cured molding compound having a top surface having a first planar region and having a second curved region, the second curved region conforming to the solder bump and positioned between the solder bump and the first planar region; and

removing a portion of the curved region to expose the solder bump, wherein the curved region has a concave surface extending outwards from the solder bump.

14. The method of claim 13 wherein pressing down on a top surface of the liquid molding compound comprises:

forming a release film on the top surface of the liquid molding compound;

applying pressure to the release film to push the liquid molding compound downward; and

removing the release film after the liquid molding compound is cured.

15. The method of claim 13 wherein removing a portion of the curved region to expose the solder bump comprises etching the cured molding compound.

16. The method of claim 15 wherein etching cured molding compound removes a portion of the curved region, and a second portion of the curved region remains after the etching step, the second portion having a thickness of less than about 1 μm.

17. The semiconductor package of claim 1 , wherein the top surface of the protection layer comprises a lowest point and a highest point, and an angle between a horizontal line and an inclined line formed between the lowest point and the highest point is between about 10 degrees and about 50 degrees.

18. The semiconductor package of claim 7 , wherein the top surface of the molding compound layer comprises a lowest point and a highest point, and a distance between the lowest point and the highest point is between about 5 μm and about 40 μm.