Patent Assignment
Reel/Frame 028869/0747
Assignment of Assignor's Interest
Recorded: 2012-08-29
Pages: 2
Assignors
LIN, JING-CHENG
Executed: 2012-08-23
CHANG, CHIN-CHUAN
Executed: 2012-08-23
HUNG, JUI-PIN
Executed: 2012-08-23
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Three Dimensional (3D) Fan-Out Packaging Mechanisms