Patent Assignment
Reel/Frame 028870/0811
Assignment of Assignor's Interest
Recorded: 2012-08-29
Pages: 2
Assignor
YAMAMOTO, ISSEI
Executed: 2012-08-18
Assignee
MURATA MANUFACTURING CO., LTD.
10-1 HIGASHIKOTARI 1-CHOME, NAGAOKAKYO-SHI, KYOTO-FU, 617-8555, JAPAN
Covered Property
(1)
Module Substrate, Module-Substrate Manufacturing Method, and Terminal Connection Substrate