Patent Assignment
Reel/Frame 028879/0781
Assignment of Assignor's Interest
Recorded: 2012-08-30
Pages: 5
Assignors
GRUBER, PETER A.
Executed: 2012-08-30
LAURO, PAUL A.
Executed: 2012-08-22
NAH, JAE-WOONG
Executed: 2012-08-22
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property
(1)
Double Solder Bumps on Substrates for Low Temperature Flip Chip Bonding
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 3, 2015
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: GLOBALFOUNDRIES U.S. 2 LLC
Reel/Frame 036550/0001 →
Assignment of Assignor's Interest
Oct 5, 2015
From: GLOBALFOUNDRIES U.S. 2 LLC; GLOBALFOUNDRIES U.S. INC.
To: GLOBALFOUNDRIES INC.
Reel/Frame 036779/0001 →
Release of Security Interest
May 12, 2021
From: WILMINGTON TRUST, NATIONAL ASSOCIATION
To: GLOBALFOUNDRIES U.S. INC.
Reel/Frame 056987/0001 →