Patent Assignment
Reel/Frame 028890/0569
Assignment of Assignor's Interest
Recorded: 2012-09-04
Pages: 3
Assignors
CHEN, ERH-HAO
Executed: 2012-08-17
LIN, CHA-HSIN
Executed: 2012-08-17
KU, TZU-KUN
Executed: 2012-08-17
Assignee
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
NO. 195, SEC. 4, CHUNG HSING RD., CHUTUNG, HSINCHU, 31040, TAIWAN
Covered Property
(1)
Method for Manufacturing Through Substrate via (Tsv), Structure and Control Method of Tsv Capacitance