Patent Assignment
Reel/Frame 028900/0515
Assignment of Assignor's Interest
Recorded: 2012-09-05
Pages: 11
Assignors
KIM, SU-KYOUNG
Executed: 2012-09-04
CHOI, GIL-HEYUN
Executed: 2012-09-04
PARK, BYUNG-LYUL
Executed: 2012-09-04
MOON, KWANG-JIN
Executed: 2012-09-04
PARK, KUN-SANG
Executed: 2012-09-04
LIM, DONG-CHAN
Executed: 2012-09-04
LEE, DO-SUN
Executed: 2012-09-04
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Integrated Circuit Device Including Through-Silicon via Structure Having Offset Interface