Patent Assignment
Reel/Frame 028902/0361
Assignment of Assignor's Interest
Recorded: 2012-09-05
Pages: 4
Assignors
HAN, SANG-UK
Executed: 2012-08-31
KWON, YOUNG-SHIN
Executed: 2012-08-31
LEE, KWAN-JAI
Executed: 2012-08-31
JUNG, JAE-MIN
Executed: 2012-08-31
CHO, KYONG-SOON
Executed: 2012-08-31
HA, JEONG-KYU
Executed: 2012-08-31
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Tape Wiring Substrate and Chip-on-Film Package Including the Same