Patent Assignment
Reel/Frame 028906/0629
Assignment of Assignor's Interest
Recorded: 2012-09-06
Pages: 2
Assignors
IWANO, TOMOHIRO
Executed: 2012-06-15
NARITA, TAKENORI
Executed: 2012-06-28
RYUZAKI, DAISUKE
Executed: 2012-06-19
Assignee
HITACHI CHEMICAL COMPANY, LTD.
1-1, NISHI-SHINJUKU 2-CHOME, SHINJUKU-KU, TOKYO, 163-0449, JAPAN
Covered Property
(1)
Slurry, Polishing Liquid Set, Polishing Liquid, Method for Polishing Substrate, and Substrate
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Address
Mar 16, 2018
From: HITACHI CHEMICAL COMPANY, LTD
To: HITACHI CHEMICAL COMPANY, LTD
Reel/Frame 045520/0090 →
Change of Name
Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name
Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →