Patent Assignment
Reel/Frame 028914/0146
Assignment of Assignor's Interest
Recorded: 2012-08-28
Pages: 2
Assignor
YOO, JIN O
Executed: 2012-08-10
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
314 MAETAN-3-DONG, YEONGTONG-GU,, SUWON, GYUNGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package and Method of Manufacturing the Same