Patent Assignment
Reel/Frame 028916/0163
Assignment of Assignor's Interest
Recorded: 2012-09-07
Pages: 3
Assignee
SEMILEDS OPTOELECTRONICS CO., LTD.
3F, NO. 11, KE JUNG RD., CHU-NAN SITE, HSINCHU SCIENCE PARK, CHU-NAN 350, MIAO-LI COUNTY, TAIWAN
Covered Property
(1)
Method for Handling a Semiconductor Wafer Assembly