IP Library › Assignment 028916/0974
Patent Assignment
Reel/Frame 028916/0974

Assignment of Assignor's Interest

Recorded: 2012-09-07 Pages: 6
Assignors
ARAI, YASUO
Executed: 2012-08-27
OKIHARA, MASAO
Executed: 2012-09-06
KASAI, HIROKI
Executed: 2012-09-06
Assignees
LAPIS SEMICONDUCTOR CO., LTD.
550-1 HIGASHIASAKAWA-CHO HACHIOUJI-SHI, TOKYO, 193-8550, JAPAN
Covered Property (1)
Semiconductor Device and Method for Manufacturing Semiconductor Device
Patent: 8,963,246 →
Application: 13/583,409 →
Publication: US 2013/0043537
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Address Mar 21, 2014
From: LAPIS SEMICONDUCTOR CO., LTD.,
To: LAPIS SEMICONDUCTOR CO., LTD.
Reel/Frame 032495/0049 →
Nunc Pro Tunc Assignment Aug 10, 2026
From: INTER-UNIVERSITY RESEARCH INSTITUTE CORPORATION HIGH ENERGY ACCELERATOR RESEARCH ORGANIZATION
To: LAPIS SEMICONDUCTOR CO., LTD.
Reel/Frame 075582/0659 →