Assignment of Assignor's Interest

Recorded: 2012-09-07 Pages: 6

Assignors

SHI, XIAO LING

Executed: 2012-08-23

HU, SUMING

Executed: 2012-08-23

MARTINEZ, LIANE

Executed: 2012-08-23

TOPACIO, RODEN

Executed: 2012-08-23

Assignee

ATI TECHNOLOGIES ULC

1 COMMERCE VALLEY DR. EAST, KEVIN O'NEIL, MARKHAM, L3T 7X6, CANADA

Covered Property (1)

Thermal Management Circuit Board for Stacked Semiconductor Chip Device

Patent: 9,209,106 →

Application: 13/529,720 →

Publication: US 2013/0343000

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.