Patent Assignment
Reel/Frame 028960/0323
Assignment of Assignor's Interest
Recorded: 2012-09-14
Pages: 4
Assignors
IWATA, YOSHIYUKI
Executed: 2012-09-01
HORI, MASARU
Executed: 2012-09-01
SAKAMOTO, HAJIME
Executed: 2012-09-01
Assignees
IBIDEN CO., LTD.
1, KANDACHO 2-CHOME, OGAKI-SHI, GIFU, 503-8604, JAPAN
NATIONAL UNIVERSITY CORPORATION NAGOYA UNIVERSITY
1, FURO-CHO, CHIKUSA-KU, NAGOYA-SHI, AICHI, 464-8601, JAPAN
Covered Property
(1)
Method for Manufacturing Printed Wiring Board