Patent Assignment
Reel/Frame 028960/0926
Assignment of Assignor's Interest
Recorded: 2012-09-14
Pages: 3
Assignors
HWANG, IN CHUL
Executed: 2012-08-20
CHO, IL HWAN
Executed: 2012-08-20
KIM, KI YOUNG
Executed: 2012-08-20
Assignee
SK HYNIX INC.
2091, GYEONGCHUNG-DAERO, BUBAL-EUB, ICHEON-SI GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Substrates Having Bumps with Holes, Semiconductor Chips Having Bumps with Holes, Semiconductor Packages Formed Using the Same, and Methods of Fabricating the Same
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.