Substrates having bumps with holes, semiconductor chips having bumps with holes, semiconductor packages formed using the same, and methods of fabricating the same
View Patent ↗Substrates and semiconductor chips are provided. The substrate or the semiconductor chip includes a body and a substantially pillar-shaped bump disposed on a first surface of the body. The pillar-shaped bump has a hole penetrating a portion thereof. Related semiconductor packages are also provided. Further, related methods are provided.
1. A substrate comprising:
a substrate body; and
a substantially pillar-shaped bump disposed on a first surface of the substrate body,
wherein a hole extends through the pillar-shaped bump and is substantially parallel to the first surface, and
wherein the area of the cross-section of the hole is smaller than the remaining area of the cross-section of the pillar-shaped bump.
2. The substrate of claim 1 , wherein the substantially pillar-shaped bump includes a conductive material.
3. The substrate of claim 1 , wherein the hole extends through and is surrounded by the substantially pillar-shaped bump.
4. A semiconductor chip comprising:
a chip body; and
a substantially pillar-shaped bump disposed on a first surface of the chip body,
wherein a hole extends through the substantially pillar-shaped bump,
wherein the hole is substantially parallel to the first surface, and
wherein the area of the cross-section of the hole is smaller than the remaining area of the cross-section of the pillar-shaped bump.
5. The semiconductor chip of claim 4 , wherein the substantially pillar-shaped bump includes a conductive material.
6. The semiconductor chip of claim 4 , wherein the hole extends through and is surrounded by the substantially pillar-shaped bump.
7. A semiconductor package comprising:
a substrate having a substrate body and a substantially pillar-shaped bump disposed on a first surface of the substrate body, wherein a hole extends through two sides of the substantially pillar-shaped bump hole and is substantially parallel to the first surface, wherein the area of the cross-section of the hole is smaller than the remaining area of the cross-section of the pillar-shaped bump;
a semiconductor chip having a chip body and a conductive electrode pattern disposed on a first surface of the chip body; and
an adhesive agent substantially filling the hole and bonding the conductive electrode pattern to the substantially pillar-shaped bump.
8. The semiconductor package of claim 7 , wherein the conductive electrode pattern includes a bump.
9. The semiconductor package of claim 7 , wherein the adhesive agent includes a solder material.
10. A semiconductor package comprising:
a semiconductor chip having a chip body and a substantially pillar-shaped bump disposed on a first surface of the chip body, wherein a hole extends through the substantially pillar-shaped bump, wherein the hole is substantially parallel to the first surface, wherein the area of the cross-section of the hole is smaller than the remaining area of the cross-section of the pillar-shaped bump;
a substrate having a substrate body and a conductive electrode pattern disposed on a first surface of the substrate body; and
an adhesive agent substantially filling the hole and electrically coupling the conductive electrode pattern to the substantially pillar-shaped bump.
11. The semiconductor package of claim 10 , wherein the conductive electrode pattern includes a bump.
12. The semiconductor package of claim 10 , wherein the adhesive agent includes a solder material.