Patent Assignment
Reel/Frame 028976/0374
Assignment of Assignor's Interest
Recorded: 2012-09-18
Pages: 10
Assignors
JANG, BOR-PING
Executed: 2012-08-22
WANG, LIN-WEI
Executed: 2012-08-22
HUANG, YING-JUI
Executed: 2012-08-22
HSIAO, YI-LI
Executed: 2012-08-24
HWANG, CHIEN LING
Executed: 2012-08-24
LIU, CHUNG-SHI
Executed: 2012-09-13
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSIN-CHU SCIENCE PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Innovative Multi-Purpose Dipping Plate