Patent Assignment
Reel/Frame 028977/0084
Assignment of Assignor's Interest
Recorded: 2012-09-18
Pages: 2
Assignors
YU, CHEN-HUA
Executed: 2012-07-09
WU, JIUN YI
Executed: 2012-07-09
WANG, TSUNG-DING
Executed: 2012-07-09
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77 R.O.C., TAIWAN
Covered Property
(1)
Package Structures and Methods for Forming the Same