Patent Assignment
Reel/Frame 028984/0008
Assignment of Assignor's Interest
Recorded: 2012-09-14
Pages: 10
Assignors
WALCZYK, JOSEPH F.
Executed: 2012-08-07
YANG, JIN
Executed: 2012-08-07
MAVEETY, JAMES G.
Executed: 2012-08-07
ALBERTSON, TODD P.
Executed: 2012-09-13
GUPTA, ASHISH
Executed: 2012-08-14
PAN, JIN
Executed: 2012-08-07
KRISHNAMOORTHY, ARUN
Executed: 2012-08-09
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95052
Covered Property
(1)
Thermal Interface for Multi-Chip Packages