Patent Assignment
Reel/Frame 028992/0700
Assignment of Assignor's Interest
Recorded: 2012-09-14
Pages: 3
Assignors
KIM, SEUNG JEE
Executed: 2012-08-20
CHUNG, QWAN HO
Executed: 2012-08-20
NAM, JONG HYUN
Executed: 2012-08-20
KIM, SI HAN
Executed: 2012-08-20
LEE, SANG YONG
Executed: 2012-08-20
SHIN, SEONG CHEOL
Executed: 2012-08-20
Assignee
SK HYNIX INC.
2091, GYEONGCHUNG-DAERO, BUBAL-EUB, ICHEON-SI GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Electronic Device Packages Having Bumps and Methods of Manufacturing the Same