Patent Assignment
Reel/Frame 028997/0853
Assignment of Assignor's Interest
Recorded: 2012-09-20
Pages: 2
Assignors
CHANG, WEI SEN
Executed: 2012-09-18
CHIANG, TSUNG-HSIEN
Executed: 2012-09-18
HU, YEN-CHANG
Executed: 2012-09-18
HSIAO, CHING-WEN
Executed: 2012-09-18
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77 R.O.C., TAIWAN
Covered Property
(1)
Wafer Level Embedded Heat Spreader