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Patent Assignment
Reel/Frame 029006/0677

ASSIGNMENT OF ASSIGNOR'S INTEREST

Recorded: 2012-09-21 Received: 2012-09-21 Pages: 3
Assignors
CHEN, KANG
Executed: 2012-09-21
LIN, YAOJIAN
Executed: 2012-09-21
Assignee
STATS CHIPPAC, LTD.
10 ANG MO KIO STREET 65, #05-17/20 TECHPOINT, SINGAPORE, SGX, 569059, SINGAPORE
Covered Application (1)
Dual Side Fan-Out Wafer Level Chip Scale Package
App. No. 61/701,366
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