IP Library › Patent Application 61701366
Patent Application Provisional
App. No. 61/701,366 · Confirmation No. 5996

Dual Side Fan-Out Wafer Level Chip Scale Package

Inventors: Yaojian Lin, Kang Chen
Provisional Application Expired
⬇ PDF
 Code Description Pages PDF
2014-02-03 EBCC.AD Notice of Change of Address Place in File Wrapper Due to Electronic Business Center(EBC) Customer Number Update 1 View
2012-10-04 N570 Communication - Re: Power of Attorney (PTOL-308) 1 View
2012-10-04 APP.FILE.REC Filing Receipt 3 View
2012-09-24 PA.. Power of Attorney 3 View
2012-09-24 N417 Electronic Filing System Acknowledgment Receipt 2 View
2012-09-14 SPEC Specification 49 View
2012-09-14 ABST Abstract 2 View
2012-09-14 TR.PROV Provisional Cover Sheet (SB16) 3 View
2012-09-14 ADS Application Data Sheet 4 View
2012-09-14 WFEE Fee Worksheet (SB06) 2 View
2012-09-14 N417 Electronic Filing System Acknowledgment Receipt 2 View
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Quick Facts
App. No.
61/701,366
Filed
2012-09-14