Patent Assignment
Reel/Frame 029027/0485
Assignment of Assignor's Interest
Recorded: 2012-09-26
Pages: 2
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77 R.O.C., TAIWAN
Covered Property
(1)
Thermal Dissipation Through Seal Rings in 3DIC Structure