Patent Assignment
Reel/Frame 029037/0134
Assignment of Assignor's Interest
Recorded: 2012-09-27
Pages: 4
Assignor
FURUYA, AKIRA
Executed: 2012-09-25
Assignee
SUMITOMO ELECTRIC INDUSTRIES, LTD.
5-33, KITAHAMA 4-CHOME, CHUO-KU, OSAKA, JAPAN
Covered Property
(1)
Method for Bonding Thin Film Piece