Patent Assignment
Reel/Frame 029038/0456
Assignment of Assignor's Interest
Recorded: 2012-09-27
Pages: 6
Assignors
ITO, TAKESHI
Executed: 2012-08-23
NANBARA, SHINTARO
Executed: 2012-08-24
ASADA, HIROKO
Executed: 2012-08-27
TANIKAWA, YUTO
Executed: 2012-08-27
TANAKA, HIDEAKI
Executed: 2012-08-27
KENMOTSU, YOICHI
Executed: 2012-08-27
Assignees
TOYO BOSEKI KABUSHIKI KAISHA
2-8, DOJIMAHAMA 2-CHOME, KITA-KU, OSAKA-SHI,, OSAKA, 530-8230, JAPAN
NIPPON MEKTRON, LTD.
12-15, SHIBADAIMON 1-CHOME, MINATO-KU,, TOKYO, 105-8585, JAPAN
Covered Property
(1)
Resin Composition for Adhesive, Adhesive Containing Resin Composition for Adhesive, Adhesive Sheet Containing Resin Composition for Adhesive, and Printed Wiring Board Including Adhesive or Adhesive Sheet as Adhesive Layer
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Aug 7, 2023
From: TOYO BOSEKI KABUSHIKI KAISHA
To: TOYOBO CO., LTD.
Reel/Frame 064504/0525 →
Change of Address
Aug 7, 2023
From: TOYOBO CO., LTD.
To: TOYOBO CO., LTD.
Reel/Frame 064505/0124 →
De-Merger
Aug 7, 2023
From: TOYOBO CO., LTD.
To: TOYOBO MC CORPORATION
Reel/Frame 064505/0803 →
Change of Name
Sep 26, 2025
From: NIPPON MEKTRON, LTD.
To: MEKTEC CORPORATION
Reel/Frame 072961/0045 →