IP Library › Assignment 072961/0045
Patent Assignment
Reel/Frame 072961/0045

Change of Name

Recorded: 2025-09-26 Pages: 11
Assignor
NIPPON MEKTRON, LTD.
Executed: 2024-07-01
Assignee
MEKTEC CORPORATION
12-15 SHIBA DAIMON 1-CHOME, MINATO-KU, TOKYO, JAPAN
Covered Properties (44)
Flexible Wiring Board with Characteristic Impedance Control Circuit
Patent: 8,242,373 →
Application: 12/227,365 →
Publication: US 2009/0236126
Seal Structure
Patent: 8,003,898 →
Application: 12/439,130 →
Publication: US 2009/0250261
Sealing Structure
Patent: 8,178,794 →
Application: 12/602,925 →
Publication: US 2010/0212953
Sealing Structure
Patent: 8,835,761 →
Application: 12/602,979 →
Publication: US 2010/0181089
Method of Producing Printed Circuit Board Incorporating Resistance Element
Patent: 8,484,832 →
Application: 12/791,701 →
Publication: US 2010/0236065
Seal Structure
Patent: 8,817,480 →
Application: 12/988,432 →
Publication: US 2011/0031703
Seal Structure for Electronic Equipment
Patent: 8,833,772 →
Application: 13/059,595 →
Publication: US 2011/0140375
Seal Structure
Patent: 8,575,499 →
Application: 13/120,882 →
Publication: US 2011/0181003
Flexible Printed Circuit Board with Component Mounting Section for Mounting Electronic Component and Flexible Cables Extending in Different Directions from the Component Mounting Section, and Method of Manufacturing the Same
Patent: 9,185,802 →
Application: 13/138,752 →
Publication: US 2012/0175154
Flexible Circuit Board and Method for Production Thereof
Patent: 9,024,198 →
Application: 13/518,470 →
Publication: US 2014/0102771
Optical and Electrical Mixed Flexible Printed Wiring Board and Method of Mounting Light Receiving/Emitting Device Thereof
Patent: 9,235,011 →
Application: 13/566,145 →
Publication: US 2013/0032703
Resin Composition for Adhesive, Adhesive Containing Resin Composition for Adhesive, Adhesive Sheet Containing Resin Composition for Adhesive, and Printed Wiring Board Including Adhesive or Adhesive Sheet as Adhesive Layer
Patent: 9,133,300 →
Application: 13/637,790 →
Publication: US 2013/0020118
Flexible Circuit Board and Its Method for Production
Patent: 9,155,193 →
Application: 13/641,769 →
Publication: US 2013/0056248
Flexible Circuit Board and Method for Manufacturing the Same, and Fuel Cell Using the Flexible Circuit Board
Patent: 9,076,997 →
Application: 13/697,151 →
Publication: US 2013/0202985
Flexible Circuit Board
Patent: 9,089,050 →
Application: 13/699,883 →
Publication: US 2013/0092421
Laser Processing Method and Production Method of Multilayer Flexible Printed Wiring Board Using Laser Processing Method
Patent: 9,148,963 →
Application: 13/703,177 →
Publication: US 2013/0089658
Sealing Structure
Patent: 9,024,184 →
Application: 13/878,830 →
Publication: US 2013/0194735
Photomask, Photomask Set, Exposure Apparatus and Exposure Method
Patent: 9,170,483 →
Application: 14/015,279 →
Publication: US 2014/0072904
Flexible Circuit Body and Method for Production Thereof
Patent: 9,635,751 →
Application: 14/113,480 →
Publication: US 2014/0124257
Lid Member with Waterproofing Function
Patent: 9,084,352 →
Application: 14/362,829 →
Publication: US 2014/0331562
Flexible Printed Circuit with Bus Bars, Manufacturing Method Thereof, and Battery System
Application: 14/370,325 →
Publication: US 2014/0370343
Manufacturing Method of Opto-Electric Hybrid Flexible Printed Circuit Board and Opto-Electric Hybrid Flexible Printed Circuit Board
Patent: 9,310,575 →
Application: 14/404,679 →
Publication: US 2015/0147022
Photomask, Photomask Set, Exposure Apparatus and Exposure Method
Patent: 9,274,415 →
Application: 14/536,978 →
Publication: US 2015/0062550
Method of Manufacturing Flexible Printed Circuit Board with Component Mounting Section for Mounting Electronic Component and Flexible Cable Sections Extending in Different Directions from the Component Mounting Section
Application: 14/868,609 →
Publication: US 2016/0044797
Flexible Printed Circuit Board with Component Mounting Section for Mounting Electronic Component and Flexible Cable Sections Extending in Different Directions from the Component Mounting Section
Patent: 9,655,239 →
Application: 14/868,619 →
Publication: US 2016/0044784
Flexible Printed Circuit Board and Manufacturing Method of Flexible Printed Circuit Board
Patent: 9,743,532 →
Application: 14/870,687 →
Publication: US 2016/0020500
Filling Method of Conductive Paste and Manufacturing Method of Multi-Layer Printed Circuit Board
Application: 14/892,345 →
Publication: US 2016/0095227
Pressure Sensing Element and Pressure Sensor
Application: 14/904,782 →
Publication: US 2016/0327441
Manufacturing Method of Multilayer Printed Wiring Board
Patent: 9,788,439 →
Application: 15/022,292 →
Publication: US 2016/0295707
Manufacturing Method of Flexible Printed Wiring Board
Application: 15/107,931 →
Publication: US 2016/0366768
Stretchable Circuit Board
Patent: 9,763,323 →
Application: 15/206,821 →
Publication: US 2017/0034907
A Pressure Sensor Capable of Suppressing Dispersion in the Initial Load of Pressure
Application: 15/222,166 →
Publication: US 2017/0089778
Stretchable Circuit Board and Method for Manufacturing Stretchable Circuit Board
Patent: 9,961,766 →
Application: 15/278,558 →
Publication: US 2017/0099730
Stretchable Circuit Board and Method for Manufacturing the Same
Application: 15/436,960 →
Publication: US 2017/0245362
Extensible Flexible Printed Circuit Board and Method for Manufacturing Extensible Flexible Printed Circuit Board
Application: 15/503,560 →
Publication: US 2017/0231082
Flexible Printed Wiring Board
Application: 15/558,371 →
Publication: US 2018/0084644
Stretchable Circuit Board and Method for Manufacturing Stretchable Circuit Board
Application: 15/569,647 →
Publication: US 2018/0116049
Method for Manufacturing Stretchable Circuit Board and Stretchable Circuit Board
Application: 15/685,622 →
Publication: US 2018/0077794
Stretchable Circuit Board and Method for Manufacturing Stretchable Circuit Board
Application: 15/690,976 →
Publication: US 2018/0092206
Manufacturing Method of Multilayer Printed Wiring Board
Application: 15/691,866 →
Publication: US 2017/0367197
Adhesive Composition Using Polyamide-Imide Resin
Application: 15/780,739 →
Publication: US 2018/0362815
Method of Manufacturing Printed Circuit Board
Application: 16/047,584 →
Publication: US 2019/0029108
Electrode Sheet
Application: 16/332,723 →
Publication: US 2019/0216352
Probe Device, Electrical Inspection Apparatus, and Electrical Inspection Method
Application: 16/668,093 →
Publication: US 2020/0166564
Related Assignments (24)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Nov 14, 2008
From: MIYAHARA, SEIICHIRO
To: NIPPON MEKTRON, LTD.
Reel/Frame 021868/0192 →
Assignment of Assignor's Interest Feb 26, 2009
From: HAYASHI, TAKAHIRO; HORA, MAKOTO; MIYAJIMA, KEIICHI
To: NOK CORPORATION
Reel/Frame 022318/0485 →
Assignment of Assignor's Interest Dec 3, 2009
From: HAYASHI, TAKAHIRO; HORA, MAKOTO; MIYAJIMA, KEIICHI
To: NOK CORPORATION
Reel/Frame 023601/0652 →
Assignment of Assignor's Interest Dec 3, 2009
From: HAYASHI, TAKAHIRO; HORA, MAKOTO; MIYAJIMA, KEIICHI
To: NOK CORPORATION
Reel/Frame 023602/0560 →
Assignment of Assignor's Interest Oct 18, 2010
From: HAYASHI, TAKAHIRO
To: NOK CORPORATION
Reel/Frame 025154/0613 →
Assignment of Assignor's Interest Feb 17, 2011
From: SASAKI, TAKASHI; NAKANO, TOMOKO; FUJISAWA, NAOHIRO; MIYAJIMA, KEIICHI
To: NOK CORPORATION
Reel/Frame 025828/0034 →
Assignment of Assignor's Interest Mar 24, 2011
From: HAYASHI, TAKAHIRO; MIYAJIMA, KEIICHI
To: NOK CORPORATION
Reel/Frame 026017/0527 →
Assignment of Assignor's Interest Sep 15, 2011
From: NOK CORPORATION
To: NIPPON MEKTRON, LTD.
Reel/Frame 026913/0998 →
Assignment of Assignor's Interest Sep 15, 2011
From: NOK CORPORATION
To: NIPPON MEKTRON, LTD.
Reel/Frame 026913/0857 →
Assignment of Assignor's Interest Sep 15, 2011
From: NOK CORPORATION
To: NIPPON MEKTRON, LTD.
Reel/Frame 026911/0121 →
Assignment of Assignor's Interest Sep 23, 2011
From: MATSUDA, FUMIHIKO
To: NIPPON MEKTRON, LTD.
Reel/Frame 027080/0004 →
Assignment of Assignor's Interest Jul 30, 2012
From: KAJIYA, ATSUSHI; YOSHIHARA, HIDEKAZU; ITANI, TORU
To: NIPPON MEKTRON, LTD.
Reel/Frame 028669/0913 →
Assignment of Assignor's Interest Aug 3, 2012
From: TAKANO, SHOJI; MATSUDA, FUMIHIKO
To: NIPPON MEKTRON, LTD.
Reel/Frame 028718/0515 →
Assignment of Assignor's Interest Sep 27, 2012
From: ITO, TAKESHI; NANBARA, SHINTARO; ASADA, HIROKO; TANIKAWA, YUTO
To: TOYO BOSEKI KABUSHIKI KAISHA; NIPPON MEKTRON, LTD.
Reel/Frame 029038/0456 →
Assignment of Assignor's Interest Nov 9, 2012
From: HIRATA, MASANORI
To: NIPPON MEKTRON, LTD.
Reel/Frame 029272/0030 →
Assignment of Assignor's Interest Nov 15, 2012
From: KAJIYA, ATSUSHI; YOSHIHARA, HIDEKAZU
To: NIPPON MEKTRON, LTD.
Reel/Frame 029300/0864 →
Assignment of Assignor's Interest Dec 10, 2012
From: MATSUDA, FUMIHIKO; NARISAWA, YOSHIHIKO
To: NIPPON MEKTRON LTD.
Reel/Frame 029437/0075 →
Assignment of Assignor's Interest Jan 3, 2013
From: KAJIYA, ATSUSHI
To: NIPPON MEKTRON, LTD.
Reel/Frame 029560/0325 →
Assignment of Assignor's Interest Apr 11, 2013
From: KAJIYA, ATSUSHI; YOSHIHARA, HIDEKAZU
To: NIPPON MEKTRON, LTD.
Reel/Frame 030196/0092 →
Assignment of Assignor's Interest Jan 15, 2019
From: NOK CORPORATION
To: NIPPON MEKTRON, LTD.
Reel/Frame 047994/0485 →
Change of Name Aug 7, 2023
From: TOYO BOSEKI KABUSHIKI KAISHA
To: TOYOBO CO., LTD.
Reel/Frame 064504/0525 →
Change of Address Aug 7, 2023
From: TOYOBO CO., LTD.
To: TOYOBO CO., LTD.
Reel/Frame 064505/0124 →
De-Merger Aug 7, 2023
From: TOYOBO CO., LTD.
To: TOYOBO MC CORPORATION
Reel/Frame 064505/0803 →
Nunc Pro Tunc Assignment Jul 20, 2026
From: MEKTEC CORPORATION
To: NOK CORPORATION
Reel/Frame 075319/0203 →