IP Library Granted Patent US 9,635,751
Granted Patent B2
US 9,635,751 · App. 14/113,480 · Granted Apr 25, 2017

Flexible circuit body and method for production thereof

Inventors: Hidekazu Yoshihara (Tokyo, JP); Akihiko Matsumaru (Tokyo, JP); Taisuke Kimura (Tokyo, JP); Atsushi Kajiya (Tokyo, JP)
Assignee: Nippon Mektron, Ltd.
H05K1/02H05K1/023H05K1/183H05K3/285H05K1/028H05K1/185H05K3/281Y10T156/1043
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 9,635,751
App. No.
14/113,480
Granted
Apr 25, 2017
Kind
B2
Abstract

Provided is a highly reliable flexible circuit body in which a flexible wiring board is prevented from wear caused by rubbing, and a method for production of the flexible circuit body. A flexible circuit body includes a flexible wiring board having an insulating film, a wiring layer formed on the insulating film, and an insulating layer formed on the wiring layer. The flexible wiring board is coated with a thermoplastic elastomer.

Claims (10)

1. A flexible circuit body comprising a flexible wiring board having an insulating film, a wiring layer formed on the insulating film, and an insulating layer having an adhesive layer formed on the wiring layer,

the flexible circuit body being configured to have a wear-resistant thermoplastic elastomer coated on at least part of a surface of the flexible wiring board, and to have an expansion-contraction portion bent to have at least one predetermined curved portion shape that is formed and retained even after expansion and contraction deformation in the flexible wiring board, with the thermoplastic elastomer being provided on at least a portion of the at least one predetermined curved portion shape of the expansion-contraction portion that is subjected to rubbing, wherein

the flexible wiring board is provided with a mounted component, and the thermoplastic elastomer is coated on a thermoplastic resin in which the mounted component is embedded,

the thermoplastic resin in which the mounted component is embedded is a low-hardness thermoplastic resin with a hardness lower than that of the thermoplastic elastomer,

the thermoplastic elastomer is a high-hardness thermoplastic polyurethane elastomer and the low-hardness thermoplastic resin is a low-hardness thermoplastic polyurethane resin, and

a hardness of the high-hardness thermoplastic polyurethane elastomer is equal to or higher than JIS A80 and equal to or less than JIS A95, and a hardness of the low-hardness thermoplastic polyurethane resin is equal to or less than JIS A70.

2. The flexible circuit body according to claim 1 , wherein the thermoplastic elastomer is laminated on at least one surface of the flexible wiring board.

3. The flexible circuit body according to claim 1 , wherein an urethane resin layer is coated on a surface of the flexible wiring board, or the surface of the flexible wiring board is subjected to plasma treatment.

4. The flexible circuit body according to claim 1 , wherein an expansion-contraction material having a shielding function of blocking an electric field and/or a magnetic field is laminated on the thermoplastic elastomer.

5. The flexible circuit body according to claim 1 , wherein a functional material having a shielding function of blocking an electric field and/or a magnetic field is mixed with the thermoplastic elastomer.

Assignments (2)
CHANGE OF NAME Recorded Sep 26, 2025
From: NIPPON MEKTRON, LTD.
To: MEKTEC CORPORATION
Reel/Frame 072961/0045 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 9, 2013
From: YOSHIHARA, HIDEKAZU; MATSUMARU, AKIHIKO; KIMURA, TAISUKE; KAJIYA, ATSUSHI
To: NIPPON MEKTRON, LTD.
Reel/Frame 031739/0334 →
Priority Claims (1)
JP 2011-098409 · Apr 26, 2011 · national
Continuity (1)
Related Publication 20140124257A1 · May 8, 2014